P364 – 1″ UHV sputter deposition Kazan
Application
UHV sputter deposition system for thin film and multilayer deposition at 1″ substrates
Year of delivery
2012
Installation site
Kazan Federal University, Russia
Design Features
- UHV magnetron sputter deposition system with combination of confocal and face to face sputter up configurations.
- Up to eight 2″ magnetrons in confocal configuration and max. one 2″ magnetron in face to face configuration.
- All magnetrons with manual in situ tilting.
- All magnetrons with easy changeable magnetic system for use with ferromagentic or non-ferromagnetic target materials.
- Partly motorized 2 axes sample manipulator with integrated motorized sample shutter, RF Bias potential otion and maximal sample temperature above 600°C.
- Two motorized wedge shutters (oriented perpendicular to each other).
- Thickness sensor setup for sputter rate check before deposition and deposition end point detection.
- Integrated bake out system.
Special Features
- System is prepared to be added to a cluster tool via transfer port at sputtering chamber.
- Handling of typical 1″ analytic sample holders possible.
Outer Dimensions
Technical specifications and performance values
General
Sputtering chamber
Size
600 mm diameter, about 690 mm height
Material
stainless steel
Vacuum
Sputtering chamber
Base pressure
< 2 *10-9 mbar
Pump down time
1 hour to < 10-6 mbar
Chamber pumping
Turbo pumping stage, chamber lid differentially pumped by dry foreline pump
Bake out
< 150°C
Manipulator features
Sputtering chamber
Sample size
diameter max. 1″ substrate
Motion axes
manualmanipulator z translation
motorized (continous) sample stage rotation
two motorized wedge shutters (mounted at chamber system) with variable motion speed and user defined positioning
Temperatures
Room temperature (not stabilized) up to 600°C at sample
Special features
Use of samples with inplane as well as out of plane magnet assamblies is possible
Performance test results
Chamber pump down
Long time sample heating
