Product categoryMagnetron sputteringSputter upSputter downFace to face sputteringConfocal sputteringSputter sidewardsE-Beam and thermal evaporationIon beam depositionMBEOther effusion cellsSample preparationIon beam etching or sample precleaningOxydationNitrationPlasma treatmentThermal treatmentComponentsSputter sourcesBakeout controllerFan heating unitMotion controllerHeating controllerApplicationThin film depositionMultilayer depositionIon beam etching or cleaningHigh power impulse magnetron sputtering (HiPIMS)Glacing angle deposition (GLAD)Sample sizeDiameter 2"Diameter 3"Diameter 4"Diameter 6"Special sizes and shapesSystem controlSemi automaticFull automaticChamber base pressurebelow 1E-9 mbarbetween 1E-9 mbar and 1E-8 mbarabove 1E-8 mbarComplexity of systemCompact single chamberCompact multi chamberComplex cluster toolType of installation siteResearchIndustryReset Filter
