Product categoryMagnetron sputteringConfocal sputteringFace to face sputteringSputter upSputter downSputter sidewardsE-Beam and thermal evaporationIon beam depositionMBEOther effusion cellsSample preparationIon beam etching or sample precleaningPlasma treatmentThermal treatmentOxydationNitrationComponentsSputter sourcesBakeout controllerFan heating unitMotion controllerHeating controllerApplicationThin film depositionMultilayer depositionIon beam etching or cleaningHigh power impulse magnetron sputtering (HiPIMS)Glacing angle deposition (GLAD)Sample sizeDiameter 1"Diameter 2"Diameter 3"Diameter 4"Diameter 6"Special sizes and shapesSystem controlFull manuallySemi automaticFull automaticChamber base pressurebelow 1E-9 mbarbetween 1E-9 mbar and 1E-8 mbarabove 1E-8 mbarComplexity of systemCompact single chamberCompact multi chamberComplex cluster toolType of installation siteResearchIndustryReset Filter
