Product category

Magnetron sputtering

Confocal sputteringFace to face sputteringSputter upSputter downSputter sidewards

E-Beam and thermal evaporationIon beam depositionMBE

Other effusion cells

Sample preparation

Ion beam etching or sample precleaningPlasma treatmentThermal treatmentOxydationNitration

Components

Sputter sourcesBakeout controllerFan heating unitMotion controllerHeating controller

Application

Thin film depositionMultilayer depositionIon beam etching or cleaningHigh power impulse magnetron sputtering (HiPIMS)Glacing angle deposition (GLAD)

Sample size

Diameter 1"Diameter 2"Diameter 3"Diameter 4"Diameter 6"Special sizes and shapes

System control

Full manuallySemi automaticFull automatic

Chamber base pressure

below 1E-9 mbarbetween 1E-9 mbar and 1E-8 mbarabove 1E-8 mbar

Complexity of system

Compact single chamberCompact multi chamberComplex cluster tool

Type of installation site

ResearchIndustry

Reset Filter